Browse Categories
Search

1" Copper Backing Plate - EQ-CBP-1


Sale Price: Call or email for pricing
If you are international, please click this.
Please email for lead time
Copper Backing Plate is used for improving the conductivity of the nonmetallic plasma sputtering targets.

SPECIFICATION
Chemical Symbol Copper
Thickness 2.3 mm
Weight 1 oz
Color Reddish Brown
Application Notes Used for bonding with nonmetallic sputtering targets.
Operation Instructions      

Related Products

2" Copper Backing Plate - EQ-CBP-2
Sale Price: USD$195.00
Shopping Cart
Your cart is empty.
Please clear the browsing history before ordering the product. Otherwise, availability and price are not guaranteed.
Mailing Lists
MTI sponsors MTI-UCSD Battery Fabrication Lab:
MTI-UCSD Battery Fabrication Lab Opening


MTI sponsors MRS and ECS Postdoctoral Award:

MTI Sponsors the Postdoctoral Awards

Upcoming Shows:
BPS 2018 62nd Annual Meeting Biophysical Society Feb 17-21 San Francisco CA Booth 909

2018 SME Annual Conference & Expo Feb 25 - 28 Minneapolis, MN Booth 701


Recent Attended Shows:
2017 MRS Fall Meeting and Exhibit Nov 26 - Dec 1 Boston, MA

2017 MMM Conference Nov 6-10 Pittsburgh, PA


Zhejiang University MSE Visiting Oct 31 Richmond CA


Click here to see our past conferences

 

Notices
1. Prices listed online are valid for US market and whom pay by credit card only. There will be extra charges for shipping & handling. Price various from country to country.
2. We may add extra charges for paper order and net30 terms due to extra labor cost.
3. The prices listed are subject to change without notice.