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High Conductive Silver Epoxy for Target Bonding - EQ-SP-05000-AB-LD


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The silver epoxy is ideal for bonding the nonmetallic plasma sputtering targets and the copper backing plate. The silver epoxy is mixed at a non-critical 1 to 1 ratio by weight or volume, and it will provide a quick conductive bond at or above room temperature. Typical cure times are approximately 4 hours at 75°C.

SPECIFICATION
Model Silver Epoxy
Conductivity
  • Volume Resistivity < 0.001 ohm-cm
  • Excellent electrical conductivity
  • High-strength conductive bonding
Weight 14 g (0.5 oz) total
Color Silver
Shelf Life 9 months
Curing
  • Small amounts can take several hours to cure at room temperature. 
  • Cure times can be accelerated by heating.
  • For the fastest curing times, maximum conductivity and adhesion, heat the bond to between 175° - 250°F (79° - 121°C) for 10 minutes and allow to cool
Operation Instructions

(Please click video to learn how to bond a target with backing plate )
              
Application Notes
  • Causes eye and skin burns. Harmful if absorbed through the skin. Causes Respiratory tract irritation. May cause allergic skin reaction.
  • Do not try to cure below 75°F/24°C.
  • Working temperature range is -131° to 212°F (-55° to 100°C).
  • Typical working pot life is 10 minutes from mixing.
  • Please email us to learn about Iridium Solder Bonding
  • Please click here to find target from A-Z

Related Products

1" Copper Backing Plate - EQ-CBP-1
Sale Price: Call or email for pricing
2" Copper Backing Plate - EQ-CBP-2
Sale Price: USD$195.00
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Notices
1. Prices listed online are valid for US market and whom pay by credit card only. There will be extra charges for shipping & handling. Price various from country to country.
2. We may add extra charges for paper order and net30 terms due to extra labor cost.
3. The prices listed are subject to change without notice.