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Combinatorial Plasma Sputtering Coater with Three 2'' magnetron Sputtering Sources and RF/DC Power Supplies - VTC-600-3HD-LD


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VTC-600-3HD-LD is a combinatorial plasma sputtering system with three 2“ magnetron sputtering sources and three RF/DC power supplies. Such a sputtering system is capable of co-sputtering up to three different target materials and create various composition profiles across the substrate (e.g. ternary materials for Li-ion rechargeable battery). This system is also suitable for sequential coating of multiple layer films such as ferroelectric, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, PTFE, etc.


SPECIFICATIONS

Compact Structure
          

Input Power
  • Single phase 220 VAC 50 / 60 Hz
  • 2000 W (including vacuum pump and water chiller)



Source Power


  • Three sputtering power sources are integrated into one control box (Click picture below to see detailed specs)
    • DC source: 500 W power for coating metallic materials (Pic 1)
    • RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials (Pic 2)
          -- Pic 1           -- Pic 2     






Magnetron Sputtering Head

                      




Vacuum Chamber

  • Vacuum chamber: 300 mm Dia. x 300 mm Height, made of stainless steel
  • Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement
  • Hinged type lid with pneumatic power pole allows easy target change
                    




Sample Stage

  • Sample holder is a rotatable and heatable stage made of ceramic heater with copper cover
  • Sample holder size: 140 mm Dia. for. 4" wafer max
  • Rotation speed: 1 - 20 rpm adjustable for uniform coating
  • The holder temperature is adjustable from RT to 500 °C max (2 hr max) with accuracy +/- 1.0 °C via a digital temperature controller
  • Optional sample holder with 800 °C max without rotation is available
                          

Gas Flow Control

  • Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gases
    • Flow rate: 0 – 200 mL/min & 0 - 100ml/min adjustable on the touch screen control panel
  • Air inlet valve is installed for vacuum release
Vacuum Pump Station
    
  • A mobile pump station is included. The sputtering coater can be placed on top of station
  • High-speed turbo pump is combined with a two-stage mechanical pump (220 L/min) for max vacuum level and faster pumping speed
  • Standard vacuum level: < 4.0E-5 Torr. Max. vacuum level: 1.0E-6 Torr with chamber baking
Water Chiller
  • One digital temperature controlled recirculating water chiller is included. (Click picture to see details)
    • Refrigeration range: 5~35 °C
    • Flow rate: 16 L/min
    • Pump pressure: 14 psi



    Optional
    • Precise quartz Film Thickness Monitor is optional, which can be into the chamber to monitor coating thickness with an accuracy of 0.10 Å
    • Precision Thin Film & Coating Analysis Systems - EQ-TFMS-LD is available at extra cost
    • Various 2” oxide and metallic targets are available upon request at extra cost. Silver epoxy and copper backing plates can be ordered at MTI
                 


    Overall Dimensions

                                            
              Lid closed: 48" × 28" × 32"         Lid open: 48" × 28" × 37"

    Net Weight of Coater

    • 160 kg

    Compliance

    • CE approval
    • MET Certification (UL 1450) is available upon request at extra cost, please contact our sales representative for the quote. 
                  

    Warranty

    • One years limited warranty with lifetime support


    Operation Instruction

                  
                             

     Application Notes

       
            Pic 1                  Pic 2              

    • A two-stage pressure regulator (not included) should be installed on gas cylinder to limit the gas output pressure below 0.02 MPa for safe usage
    • In order to remove oxygen from the chamber, MTI suggest you to use 5% Hydrogen + 95 % Nitrogen to clean the chamber 2-3 times, which can reduce oxygen level to < 10 ppm
    • Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar usually contains 10 - 100 ppm oxygen and H2O depending on the supplier. MTI suggest you to use gas purification device to purify gas before filling in. (Click Pic #1 & #2 on the left to order)
    • For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding (Click Pic #3 below)
    • MTI supplies single crystal substrate from A to Z (Click Pic #4 below to order) 
    • MTI Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C (XRD profile in Pic #5 below)
    • Test the flexibility of the thin film / coated electrode with EQ-MBT-12-LD mandrel bending tester. (Pic #6)
    • HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
    • DO NOT use tap water in water chiller. Must use Rust Protection Coolants to prevent rust and corrosion.
    • Pic 3 Pic 4 Pic 5 Pic 6

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    Notices
    1. Prices listed online are valid for US market and whom pay by credit card only. There will be extra charges for shipping & handling. Price various from country to country.
    2. We may add extra charges for paper order and net30 terms due to extra labor cost.
    3. The prices listed are subject to change without notice.