Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaimination free coolant during crystal cutting. Through several years effort, finally, MTI provides market a quality diamond wire with reasonable price. Features: Electroplated diamond wire with 0.254 mm diameter based on a high strength steel wire 80 microns diamond particle for effectively cutting and slicing of ceramic and crystal. 100 meters (333 feet) per roll as standard package, Perfect for cutting Sapphire or SiC single crystal Super quality Made in USA Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc Test result from Multiwire diamond saw, 3" sapphire, 200 / ingot cutting time is about 5 hours 3" SiC, single wafer slicing, , cutting time is about 6 hours