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Mini Plasma Sputtering Coater with Vacuum Pump & Gold Target, 1.5" Max Sample - GSL-1100X-SPC12-LD

In stock
Item Number: GSL-1100X-SPC12-LD
Transported by LTL Freight (Truck)


GSL-1100X-SPC12-LD is a compact plasma sputtering coater designed for making metallic coatings, such as gold, platinum, Indium and silver etc. Especially for coating conductive gold film for SEM sample. The plasma sputtering coater is shipped with all necessary accessories for immediate use, including one sputtering head with gold sputtering target (gold cathode), vacuum pump, stainless steel bellows and quick clamps.


Input Power
  • Single phase 208 - 240 VAC, 50 / 60 Hz
  • < 1000 W (including vacuum pump)
  • If the voltage is 110 V, a 1500 W transformer can be ordered at MTI (Click the picture to the left for detail)
Vacuum Chamber
  • Vacuum chamber: 100 mm ID x 130 mm H, made of fused glass
  • Sealing flange made of stainless
  • Needle valve on front panel for gas flow control
Sample Stage

  • Stage size: 40 mm Dia.
  • Sputtering distance range: 15 - 80 mm adjustable
Control Panel
  • Vacuum gauge and sputtering current meter for monitoring deposition
  • Needle valve on front panel for gas flow control
  • Sputtering timer: 0 - 110 s adjustable
Vacuum Pump

The followings are included: 
Optional: you may use a turbo pump to achieve 1.0E-5 Torr vacuum by a turbo pump (Click the bottom right picture)

Sputtering Targets

  • Target size requirements: 57 mm Dia. x 0.5 mm max
  • 4N purity gold foil: 57 mm Dia. x 0.12 mm (Included and pre-installed on coater) 
  • Optional Targets are available (Click below to order)
    • Au target (57 mm Dia. x 0.12 mm, 4N purity) 
    • Pt target (57 mm Dia. x 0.12 mm, 4N purity)  
    • Ag target (57 mm Dia. x 0.5 mm, 4N purity)  


  • 480 mm L x 320 mm W x 280 mm H
               (Click to enlarge the picture)

Net Weight

  • 20 kg

Shipping Weight

  • 55 kg (120 lbs) with 1020 mm x 790 mm x 560 mm (40" x 31" x 22") dimension with crating


  • CE approval
  • MET certification (UL 1450) is available upon request at extra cost. Please contact our sales representatives for quote


  • One year limited warranty with lifetime support

Operation Insturctions


Application Notes       

  • For the best film-substrate adhesion strength, please clean the substrate surface before coating:
    • Ultrasonic cleaning (Click the picture below to order) with the following sequential baths - (1) acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate with N2, then hot bake in vacuum to remove absorbed moisture
    • Plasma cleaning (Click the picture below to order) may be needed for surface roughening, surface chemical bonds activation, or additional contamination removal
    • A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve adhesion of metals and alloys
            Ultrasonic Cleaner                  Plasma Cleaner
  • A two-stage pressure regulator (not included) should be installed on the gas cylinder to limit the output pressure of gas to below 0.02 MPa for safe usage. Please use > 5N purity Ar gas for plasma sputtering
  • The sputtering coater can be placed into an Ar and N2 gas glove box for coating
  • HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the equipment before sample loading and target changing operations
  • This model is not suitable for coating light metallic material such as Al, Mg, Zn, or Carbon target due to low energy. Please consider our magnetron sputtering coater or thermal evaporation coater. (Click pictures below for detail)
           Magnetron Sputtering             Thermal  Evaporation          Operation Under Ar Gas inside the Glove Box

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3. The prices listed are subject to change without notice.