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Diamond on Silicon Wafer, 4", 2 um Thick, 10 nm Ra


In stock
Item Number: DOS-01-4-10-US5

Specifications:

  • Film:UNCD (Ultrananocrystalline Diamond)
  • Wafer Size: 4" diameter  x 0.5 mm
  • Si wafer Orientation: (100) + / - 0.5o
  • Diamond film thickness:   2 micron
  • Resistivity:           10E3 ~ 10E4 ohm-cm
  • Surface Roughness:   as grown,  RA < 10 nm
  •  Package: One 1000 class clean room with 100 class plastic bag


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1. Prices listed online are valid for US market and whom pay by credit card only. There will be extra charges for shipping & handling. Price various from country to country.
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3. The prices listed are subject to change without notice.