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Diamond wafer on silicon is used for MEMS development, tribological testing, and unique nano-scale processing applications. The diamond wafers offer the ability to create and experiment with the extraordinary properties of diamond, using the award winning family of UNCD materials. We provide two kinds of diamond wafers, e.g. diamond on silicon (DOS) , diamond on Oxide (DOI) and Electric Conductive Diamond on Insualtor Wafer(DCI) from 10x10mm to 4" diameter.
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U.S. Dept. of Commerce requires End User Certificate for exporting this product. Oversea end users must file the end user certificate form (click to download) and all sales are subject to get approval by U.S. Dept. of Commerce before shipping.
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MS&T 2012, Booth# 536, Oct.9-10, 2012, Pittsburgh, PA, USA
 Nanotech 2012, Booth# 712, June 19-20, 2012, Santa Clara, California
 ECS 221st, Booth#208, May 7-9, 2012, Seattle,WA, USA
 SVC TechCon2012, Booth# 739, May 1- 2, 2012, Santa Clara, California
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Notices
1. The price listed on line is valid for US market and who pay by credit card only. There will be extra cost for shipping and handling. The price is different from country to country
2. We may add extra cost for paper order and net 30 term due to extra labor cost
3. The price is subject to change without notice
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