Diamond Wire of 0.12 mm Dia. x 65 m L ( 215 feet) for Wire Saw Cutting EQ-DW012x65

Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate.  The diamond wire  produces minimum kerf loss, less sub-surface damage, and contaimination free coolant during crystal cutting.  Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price.  Features: Electroplated diamond wire with 0.12 mm diameter based on a high strength steel wire 20 microns diamond particle for effectively cutting and slicing of ceramic and crystal. 65 meters (215 feet) per roll as standard package Perfect for cutting Sapphire or SiC single crystal Super quality made in USA Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc