Diamond Wire of 0.25 mm Dia. x 200 m L ( 666 feet) for Wire Saw Cutting -Made in USA - EQ-DW025x200

Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate.  The diamond wire  produces minimum kerf loss, less sub-surface damage, and contaimination free coolant during crystal cutting.  Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price.  Features: Electroplated diamond wire with 0.254 mm diameter based on a high strength steel wire 80 microns diamond particle for effectively cutting and slicing of ceramic and crystal. 200 meters (666 feet) per roll as standard package, and optional upto 1000 meter continous wire Perfect for cutting Sapphire or SiC single crystal Super quality made in USA Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc Test result from Multiwire diamond saw, 3" sapphire, 200 pieces / ingot cutting time is about 5 hours 3" SiC,  single wafer slicing , cutting time is about 6 hours