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Precision CNC Dicing / Cutting Saw with Accessories & Laptop and Software - SYJ-400
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Click to enlarge
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In stock
Item Number: SYJ-400
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SYJ-400 ( upgraded EC-400 ) is a CE certified precise and cost effective dicing and cutting solution for R&D Lab in Materials and Micro-electronics research field. It is designed for dicing and cutting almost all kinds of materials up to 4" diameter wafer or 8" L x 4" W x 1" H components at low cost. The EC-400 saw can be computerized with position accuracy of 0.01 mm or better. The sample stage with two-angle adjustment allows customers to cut materials at the desired angle with +/- 0.5° tolerance. Laptop with software and USB cable installed and for immediate use.
SPECIFICATIONS
Voltage
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AC 110V or AC 220V +/- 10% (please select and highlight the working voltage in your requirement.)
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| Motor
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Brush-less magneto DC motor (110V) with variable speed up to 3,000 rpm. Power consumption: 180W
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| Effective Cutting Range
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3 dimension: X-axis: 8" Y-axis:4" Z-axis:4"
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| Accuracy
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0.0025 mm moving resolution and 0.01 mm position accuracy.
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| Cutting Blades Kits
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One 4" dia x 0.35 mm thick fully sintered diamond blade
Two pairs of flanges with 62 mm dia. ( for dicing ) and 42 mm dia. (for deep cutting)
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| Control mode
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Manual control / PC control
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| Water Cooling
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Assemblies of water jetting, draining, and splashing protection are included.
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| Net WT& DIMEN
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Net Weight: 28.5 kg
580 L x 560 W x 660 H (mm)
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| Shipping WT & DIMEN
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Shipping weight : 150 lbs
43"L x 30"W x 34"H (inch)
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Warranty
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One year limited --- including all electronic and mechanical parts, but not including damages caused by misuse, such as rusted part from inadequate storage and broken parts by the user.
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| Certification
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 CE certified
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Standard Accessories:
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Description
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Quantity
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Price for replacement, USD
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Picture
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| EC 401
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Cross mount vise
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1 pcs
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129.00/ea
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| EC 403
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Controller with connecting cables
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1 set
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850.00/set
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| EC 404
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Mechanical chuck
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1 pcs
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150.00/ea
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| EC 405
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Water splash guard for covering 4" blade
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1 pcs
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100.00/ea
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| EC 406
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Aluminum plate
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2 pcs
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10.00/ea
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| EC 407
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Wax for gluing samples
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2 pcs
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5.00/ea
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| EC 408
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Graphite plate for holding samples
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2 pcs
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10.00./ea
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| EC 409
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Fully sintered diamond blade 4"x 0.3mm x 1/2" arbor
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1 pcs
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138.95/ea
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| EC 410-6
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Blade clamps (62 mm in dia.)
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1 pair
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30.00/pair
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| EC 410-4
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Blade clamps (42 mm in dia.)
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1 pair
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20.00/pair
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| EC 411
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4" Steel plate for holding samples
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1 pcs
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50.00/ea
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| EC 412
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Screw drivers
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1 set
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n/a
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| EC 413
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Water and drain hoses
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1 set
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20.00/set
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| EC 414
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Operation manual and software
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1 set
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n/a
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| EC300
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Plastic splash-protection cover
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1 set
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200.00/set
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| EC550
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A 14"-15" laptop with software installed
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1 set
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799.00/set
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Optional Accessories * ( click thumb-picture to see detail )
* Optional parts are not included in standard package. You have to order separately. Prices are subject to change without notice
Smart Tip and Options
- Must use anti-corrosion coolant during cutting to avoid rusting the lead screw. Please never use water as coolant during cutting.
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You may select our LubeCool-150 lubricant as coolant, and build up a small circulation system with 6L circulating coolant tank , which will make the diamond blade cut more efficiently and prevent corrosion. Also, you can use W10-30 motor oil as coolant, which is available at any Auto store.
- Always clean machine, especially the lead screw using WD-40 lubricant (1 can included) after each use. Make sure the X, Y and Z axes can move freely without blocking and rusting.
- For dicing Si, Ge, GaAs and quartz, LiNbO3 wafers, you may consider to use 100 microns ultra-thin diamond blade because of less kerfs.
- In order to ensure accurate alignment when cutting wafer, you should choose 25x stereo microscope with support frame (P/N ECO 421).
- Vacuum chuck and alignment microscope for easy wafer dicing are available as optional parts.
- For mounting wafer easily and quickly, you may also choose a vacuum chuck (P/N ECO402) and adhesive film (P/N ECO 419).
- Add MT45 microscope set and digital camera head to monitor dicing sample accurately on computer screen (please click picture below to see what looks like)
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Please clear the browsing history before ordering the product. Otherwise, availability and price are not guaranteed. | |
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MS&T 2012, Booth# 536, Oct.9-10, 2012, Pittsburgh, PA, USA
 Nanotech 2012, Booth# 712, June 19-20, 2012, Santa Clara, California
 ECS 221st, Booth#208, May 7-9, 2012, Seattle,WA, USA
 SVC TechCon2012, Booth# 739, May 1- 2, 2012, Santa Clara, California
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Notices
1. The price listed on line is valid for US market and who pay by credit card only. There will be extra cost for shipping and handling. The price is different from country to country
2. We may add extra cost for paper order and net 30 term due to extra labor cost
3. The price is subject to change without notice
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