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BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)


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Item Number: TG-BiFeO3-76D3175CN

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  • Composition:    Bismuth Iron Oxide BiFeO3  Target
  • 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
  •  Purity:            > 99.99%


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