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Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419

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Item Number: EQ-ECO-419
  • High strength film is for bonding wafer ( up to 6" dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with  < 6" diameter vacuum chuck.
  • Width: 6.5"
  • Thickness: 0.25 mm
  • Length:   Price sold by 10 feet per quantity

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MS&T 2012, Booth# 536, Oct.9-10, 2012, Pittsburgh, PA, USA

Nanotech 2012, Booth# 712, June 19-20, 2012, Santa Clara, California
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Notices
1. The price listed on line is valid for US market  and who pay by credit card only. There will be extra cost for shipping and handling. The price is different from country to country
2. We may add extra cost for paper order and net 30 term due to extra labor cost
3. The price is subject to change without notice