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Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD

In stock
Item Number: EQ-ECO-419-LD
EQ-ECO-419-LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with  < 6" diameter vacuum chuck.







Price sold by 10 feet per quantity


It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing.

Application Notes

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Sale Price: USD$350.00
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