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Plastic Foam Module Wafer Carrier for Single 4" Wafer (1-4) (SP4-12012T/BK)

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Item Number: SP4-12012T/BK

Quantity Discounts - Order a quantity in the range below to receive the discount

QuantityAmount
50 to 99USD$3.75
100 to 499USD$3.56
500 to 1000USD$3.36
Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely.
 Specifications

TYPE:SP4-12012T/BK
Inside Dimension: 4 " diameter
Outside Dimension: 120mm x 120mm x 12mm
Color: Cover:Transparent/Body:blac

Module Structure in box:       Two 4" diameter holes for 4" diameter wafer , double foam insert modules are included

 

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Mailing Lists

MS&T 2012, Booth# 536, Oct.9-10, 2012, Pittsburgh, PA, USA

Nanotech 2012, Booth# 712, June 19-20, 2012, Santa Clara, California
ECS 221st, Booth#208, May 7-9, 2012, Seattle,WA, USA
SVC TechCon2012, Booth# 739, May 1- 2, 2012, Santa Clara, California





 
 
 
Notices
1. The price listed on line is valid for US market  and who pay by credit card only. There will be extra cost for shipping and handling. The price is different from country to country
2. We may add extra cost for paper order and net 30 term due to extra labor cost
3. The price is subject to change without notice