Principal Uses for UV Grade Fused Silica

Laser optics, optical grade UV Fused Silica windows and lenses, mirror blanks and substrates, wedges, optical beamsplitters and filters, prisms, lightpipes, space and aircraft windows, solar cells, high quality coating substrates and wafers, heater tubing, and graded seals.

Applications for UV Grade Fused Silica Wafers

Common UV, low CTE, optoelectronic, high temperature, thermal imaging, measurement and sensor technology, astronomical, microlithography, MEMS, Excimer and Nd:YAG laser applications, and where superior grade fused silica wafers are needed.

Thermal/Mechanical Properties of  UV Grade Fused Silica

• Coefficient of Thermal Expansion (CTE):
  0.52 ppm/K @ 5-35ºC
  0.57 ppm/K @ 0-200ºC
  0.48 ppm/K @ -100 - 200ºC
  
• Young's Modulus: 72.1 GPa
• Shear Modulus: 30.6 GPa
• Modulus of Rupture, abraded: 52.4 MPa
• Bulk Modulus: 37.4 GPa
• Poisson's Ratio: .179
• Density (at 25ºC / 77ºF): 2.201 g/cm³
• Knoop Hardness (100g load): 522 kg/mm²
• Compressive Strength: 1.14 GPa
• Tensile Strength: 54 MPa
• Strain Point: 893°C/1639.4°F
• Annealing Point: 1042°C/1907.6°F
• Softening Point: 1585°C/2885°F
• Specific Heat: .770 J/g K
• Thermal Conductivity: 1.38 W/mK
• Thermal Diffusivity: .0075 cm²/s

Optical Properties

Refractive Index: n_D = 1,45840 (589nm)
Optical Transmission Data:

Electrical Properties

Dielectric Constant: E= 3.8

Please click here for MSDS