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Au(Gold) coated on Si(100) substrate ( P-type B-doped ) ,4"x0.525 mm,1sp Au= 50nm (± 5nm), Cr=5 nm

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Item Number: Au on SIa 101D0525C1
4" gold coated silicon wafers, useful for a variety of applications such as SEM or AFM supports, nanotechnology and biotechnology. Both Cr and Au are evaporated on the silicon wafers using a vacuum evaporation system with chromium between the glass and the gold to serve as an adhesion layer. The gold surface is not atomically flat, but has bumps in the nm range. The wafers are packed and shipped in a wafer carrier. Au coating should be stable to about 175° C; above that temperature delamination could occur.

Silicon Wafer Specifications:

  • Film:         Au coated on Si substrate ,4"x0.525 mm,1sp  P-type B-doped,

                        Orientation of Au film:  <111> polycrystalline with thickness: 50nm 
      • Cr=5nm (adhesion layer )
      • Average Surface roughness Ra or RMS:      < 10 A in RMS
      • Max thermal budget of Au film: less than 200 degree C

  • Substrates Silicon: Prime Grade
  • P type, B doped
  • Orientation: <100>
  • Resistivity:                  1-20
  • Substrate Size:            4" in diameter x  0.525 +/- 0.020 mm thk
  • Polish:                        one side polished
  • Optional:  you may need tool below to handle the wafer ( click picture to order )

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