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Bench-Top Double Side Lapping / Polishing Machine for Max. 2" wafer - EQ-Unipol-160D
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Click to enlarge
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In stock
Item Number: EQ-Unipol-160D
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| EQ-UNIPOL-160D machine is bench-top precision double side lapping and polishing machine. It can lap and polishing 4 pieces of Max. 2" wafers in double sides at same time, and achieves TTV less one micron in 2" diameter area. It is idea tool to prepare Si, Ge and oxide single crystal wafer with diameter 2" or less in the laboratory.
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1. Type: unipol-160D
2. Lapping plate dimension: 225 x 94 x 15mm (Outer dia. x Arbor dia. x Thickness)
3. Weight of upper lapping plate and balance: 5.5kg (3kg for balance weight)
4. Gearing template specification: z=54 m=1.5 dia.81mm (metric)
5. Number of gearing templates for simultaneous use: 4
6. Largest work piece size: dia. 60mm
7. Accuracy of flatness and parallelism: 0.001mm
8. Accuracy of lapping and polishing: +/-0.001mm
9. Surface finish: > grade 10
10. Input Power: single phase 220v
11. Motor: DC/600W
12. Dimension: 615x375x494mm
13. Net Weight: 80kg
14: Complete accessories are ncluded for immediate use
Standard Accessories Iin the package
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Item No.
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Description
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Qty
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Pictrue
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EQ-unipol-160D-01
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Polishing plate
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2
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EQ-unipol-160D-02
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Lapping plate
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2
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EQ-unipol-160D-03
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Polishing template gear
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4
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EQ-unipol-160D-04
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Polymide polishing pad
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2
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EQ-unipol-160D-05
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Poromeric polishing pad
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2
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EQ-unipol-160D-06
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Axle key holders (pre-install in the upper polishing plate)
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2
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EQ-unipol-160D-07
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Ring feeding channel (pre-install in the upper polishing plate)
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1
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EQ-unipol-160D-08
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Ring weight
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3
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EQ-unipol-160D-09
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Water pipes
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2
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EQ-unipol-160D-10
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10A Fuse
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2
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EQ-unipol-160D-11
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Screw drivers
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2
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EQ-unipol-160D-12
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Power cord
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1
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Note:
Four pieces of gearing templates are required for double sides polishing. (MTI can provide the gearing template with various hole size at extra cost (~$30/template). One template can hold sample as the follows:
- One 60 mm or 2" diameter wafer
- 3 pcs or less 1" diameter wafer
- 14 pcs or less 10x10mm substrate
To get a quote for gearing template please let us know wafer size and final thickness to be polished.
 View product manual
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MS&T 2012, Booth# 536, Oct.9-10, 2012, Pittsburgh, PA, USA
 Nanotech 2012, Booth# 712, June 19-20, 2012, Santa Clara, California
 ECS 221st, Booth#208, May 7-9, 2012, Seattle,WA, USA
 SVC TechCon2012, Booth# 739, May 1- 2, 2012, Santa Clara, California
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Notices
1. The price listed on line is valid for US market and who pay by credit card only. There will be extra cost for shipping and handling. The price is different from country to country
2. We may add extra cost for paper order and net 30 term due to extra labor cost
3. The price is subject to change without notice
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