Search:

2" Copper Backing Plate - CuBP50D25T

Sale Price: USD$29.98

If you are international, please click this.

In stock

Item Number: CuBP50D25T

Email this page to a friend

Copper Backing Plate is used for improving the conductivity of the nonmetallic plasma sputtering targets.

SPECIFICATION

Chemical Symbol	Copper
Thickness	2.5mm
Weight	2 oz
Color	Reddish Brown
Application Notes	Used for bonding with nonmetallic sputtering targets.
Operation Instructions

Related Products

1" Copper Backing Plate - EQ-CBP-1

Sale Price: Call or email for pricing

High Conductive Silver Epoxy for Target Bonding - EQ-SP-05000-AB-LD

Sale Price: USD$219.98


	Your cart is empty. Please clear the browsing history before ordering the product. Otherwise, availability and price are not guaranteed.


	Email Address:

MTI sponsorships:
MTI Sponsors Thermoelectrics Workshop

MTI-UCSD Battery Fabrication Lab

MTI Sponsors the Postdoctoral Awards

Upcoming Shows:

ABAA Meeting 14 Oct 29 - Nov 1 Ho Chi Minh Vietnam

2023 MRS Fall Meeting Nov 26 - Dec 1 Boston MA

Advanced Automotive Battery Conference AABC 2023 December 11 - 14 San Diego Booth 107

Recent Attended Shows:
ACS Fall 2023 August 13 - 17 San Francisco CA Booth 664

AABC Europe 2023 June 19 - 22 Mainz Germany Booth 602

ICT 2023 June 21 - 25 Seattle WA

Click here to see our past conferences

Notices

1. Prices listed online are valid for the US market and who pay by credit card only. There will be extra charges for shipping & handling. Prices vary from country to country.
2. We may add extra charges for paper orders and NET 30 terms due to extra labor costs.
3. The prices listed are subject to change without notice.