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Cu Film on Ti/Silicon Wafer, 4", Cu=400 nm Ti=40nm, Si(100)N-type P-doped, 4" x0.525mm,R:1-20 ohm.cm, 1sp


In stock
Item Number: FmCu400Ti40onSiPa101D05C1R1

Specifications:

  • Cu coated Si Wafer (4 inch size)
  • Film:Thickness of  highly oriented polycrystalline Cu <111> film: 400nm, Ti glue layer (40 nm)
  • 4 inch dia x0.525 mm thickness Si wafer (Prime Grade) 
  • N type, P- doped, <100> orientation, SSP
  • Resistivities: 1-10 ohm-cm
  • Surface Roughness:   as grown , N/A
  • Package: One 1000 class clean room with 100 class plastic bag

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