|
|
Home Page
Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting EQ-DW0125x65
|
|
In stock
Item Number: DW0125X65
Quantity Discounts
| Quantity | Amount |
| 5 to 9 | USD$90.16 |
| 10 to 19 | USD$88.20 |
| 20 or more | USD$83.30 |
|
|
Diamond wire cutting is a state-of-the-art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.
Specifications:
| Part Number |
EQ-DW0125x65
|
| Tensile Strength |
30 N
|
Features
|
- Electroplated diamond wire with 0.125 mm (+/-0.01) diameter based on a high strength steel wire
- 20 microns diamond particle for effectively cutting and slicing of ceramic and crystal.
- Core wire diameter 0.1 mm
- 65 meters (215 feet) per roll as the standard package
- Perfect for cutting Sapphire or SiC single crystal
- Super quality made in the USA
- Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc
|
|
|
|
|
| | |
|
Your cart is empty.
Please clear the browsing history before ordering the product. Otherwise, availability and price are not guaranteed. | |
| | |
|
MTI sponsorships:
MTI Sponsors Thermoelectrics Workshop
MTI-UCSD Battery Fabrication Lab
MTI Sponsors the Postdoctoral Awards
Upcoming Shows:
|
|