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Diamond Wire of 0.25 mm Dia.with Optional Length for Wire Saw Cutting -Made in USA - EQ-DW025


Sale Price: Starting at USD$198.00
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Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate.  The diamond wire  produces minimum kerf loss, less sub-surface damage, and contaminant-free coolant during crystal cutting.  Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price. 

Specifications:

Part Number EQ-DW025
Tensile Strength 75 N
Features

  • Electroplated diamond wire with 0.25 mm (+/-0.02) diameter based on a high strength steel wire
  • 80 microns diamond particle for effectively cutting and slicing of ceramic and crystal.
  • 65 mete (215 feet) or 100 meters (333 feet) or 200 meters (656 feet) per roll as standard package,
  • Perfect for cutting Sapphire or SiC single crystal
  • Super quality Made in USA
  • Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc.
Test Result From Multiwire Diamond Saw
  • 3" sapphire, 200 / ingot cutting time is about 5 hours
  • 3" SiC,  single wafer slicing, , cutting time is about 6 hours

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Notices
1. Prices listed online are valid for the US market and who pay by credit card only. There will be extra charges for shipping & handling. Price various from country to country.
2. We may add extra charges for paper order and net30 terms due to extra labor costs.
3. The prices listed are subject to change without notice.