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Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD

Sale Price: USD$59.00

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Item Number: ECO419

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EQ-ECO-419-LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with < 6" diameter vacuum chuck.

SPECIFICATIONS:

Width	6.5"
Thickness	0.25mm
Length	Price sold by 10 feet per quantity
Item	It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing.
Application Notes

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1. Prices listed online are valid for the US market and who pay by credit card only. There will be extra charges for shipping & handling. Price various from country to country.
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