Browse Categories

Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD

In stock
Item Number: EQ-ECO-419-LD
EQ-ECO-419-LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with  < 6" diameter vacuum chuck.







Price sold by 10 feet per quantity


It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing.

Application Notes

Related Products

4" Vacuum chuck - EQ-ECO-402
Sale Price: USD$350.00
Shopping Cart
Your cart is empty.
Please clear the browsing history before ordering the product. Otherwise, availability and price are not guaranteed.
Mailing Lists
MTI sponsorships:
MTI Sponsors Thermoelectrics Workshop

MTI-UCSD Battery Fabrication Lab

MTI Sponsors the Postdoctoral Awards

Upcoming Shows:
2018 MRS Fall Meeting and Exhibit Nov 25 - 30 Boston MA Booth 901

APS March Meeting 2019 March 4-8 Boston MA Booth 312

TMS 2019 March 10-14 San Antonio TX Booth 101

Recent Attended Shows:
MS&T 2018 Oct 14-18 Columbus OH

Furnaces North America Oct 8-10 Indianapolis IN

AiMES 2018 Sept 30 - Oct 4 Cancun Mexico

Click here to see our past conferences


1. Prices listed online are valid for US market and whom pay by credit card only. There will be extra charges for shipping & handling. Price various from country to country.
2. We may add extra charges for paper order and net30 terms due to extra labor cost.
3. The prices listed are subject to change without notice.