Reflectance Spectrometer for Film Thickness Measurement from 15nm to 50 um - EQ-TFMS-LD

• Real time measurement and analysis: Multi-layer, thin, thick, freestanding and nonuniform layers
• Extensive material library: 500+ materials
• Support of parameterized materials: Cauchy, Tauc-Lorentz, Cody-Lorentz, EMA
• Flexible: Desktop or in-situ, R&D or inline.
• Measurement: Thickness, optical constants, surface roughness
• User-friendly and powerful: One-click measurement and analysis

• Oxides (See Pic 1 for example)
• Nitrides
• Photoresists
• Polymers (See Pic 2 for example)
• Semiconductors: Si, aSi, polySi
• Hard Coating: SiC, DLC
• Polymer Coating: Paralene, PMMA, Polyamides
• Thin Metal Coating  (< 50 nm thickness. See Pic 3 for example)

  Pic 1 - 3 um LiNbO3	Pic 2 - 45 um PET	Pic 3 - 20 nm Cu

• 15 nm - 75 um  for non-metallic, translucent materials as listed above 
  
• Note: metallic films can only be measured up to 50 nm reliably; X-Ray measurements are needed for thicker films
  

• 400 nm - 1100 nm

• 0.01 nm or 0.01%

• 0.2% or 1 nm

• 0.02 nm or 0.03%

• 2 mm minimum

• Minimum 5 mm x 5 mm for reliable measurement  

• 2048/4096 pixels CMOS
• 16 bit ADC
• 400 - 1100 nm wavelength range
• Spectral resolution: < 1 nm
• Power 100 -240 VAC, 50/60 Hz, 20 W power
• 

• 5 W Tungsten-halogen lamp
• CT 2800 degree
• Lifetime: 10000 hours

• Fiberoptics, 400 um fiber core
• with spectrometer leg and Illumination leg

• The film sample faces up with probe and light source pointing down
• 

• USB connector to communicate with PC
• One brand new Laptop with software installed is included for immediate use

• Large library of refractive index (n) and extinction coefficient (k) values for the most common metallic, dielectric, amorphous and crystalline substrate materials
• Capability for analyzing simple and the most complex film stacks
  
• Error estimation and simulation tools allow for factoring in the effects of changing conditions
• Support for parameterized materials with approximations representing optical dispersion in a desired spectral range using few coefficients that can be adjusted
•   

• Remote control (TCP) based on Modbus protocol at extra cost

• Bare Si Reference and 200 nm thick silicon oxide test wafer are included as thin-film standards for thickness measurement verification
•   

Dimensions

• 205 mm L x 250 mm W x 105 mm H (8" L x10" W x4" H)

Net Weight

• 4.5 kg (10 lbs)

Shipping Dimensions

• 460 mm L x 460 mm W x 460 mm H (18" L x18" W x 18" H)

Shipping Weight

• 9.1 kg (20 lbs)

Warranty

• One-year limited warranty with lifetime support. (Consumable parts such as thin film measurement standard not covered by the warranty)

Operation Instruction

Application Note

• An example of metal thin film thickness measurement using the reflectance spectrometer can be downloaded here (Click Pic below)
•